Electro-Thermal Analysis (PTM-ET™)

There is a strong interdependence between temperature and current in power devices. Temperature depends on internal and external heat sources and on the available heat sinks. In extreme cases, increased temperature can lead to localized current concentration – which in turn leads to more temperature rise. This can result in current concentrating onto just a few fingers, leading to device failure.

Unfortunately circuit simulators do not have the ability to properly model thermal characteristics in enough detail to be useful by themselves for solving this problem. Likewise, tools that typically can model the thermal behavior do not properly handle the temperature-current relationship to predict dynamic behavior of such a system.Magwel^® offers a single solution that takes into account electrical and thermal behavior to solve in a deterministic way how a power device behaves as current is applied in its actual thermal environment. PTM-ET™ models junction and metal heating in the device as a function of applied current and understands how the die, package and board each contribute to thermal flux.

• • Chip/package-level 3D electro-thermal coupling and reliability analysis
  • Computes dynamic currents and Joule self-heating in metal & active area
  • Models heat flow in chip & package
  • Supports thermal planning
  • Supports non-linear temperature-dependent models
  • Self-consistent solution of electrical and thermal equations in 3D solver
  • Silicon verified accuracy
  • Imports GDSII & OpenAccess

 

Part of the PTM^® Product Family