Interconnect simulations with 3DPET

3DPET is capable of analyzing large multi conductor interconnect structures. When setting up a simulation, external lumped elements such as resistors, capacitors and inductors can be connected to the structure and integrated in the same simulation. 3DPET generates nxn scattering matrices of the simulated structure, where n is the number of transmission lines. The extraction module extracts RLCG matrices in a command line or GUI environment.

The integrated DevEM simulator technology, which integrates device and metal interconnect simulation can simulate critical interconnect nets that include critical device parasitics for nanometer processes. This unique feature adds a new dimension to interconnect simulations.

3DPET's standard xml based input format enables the user to create and characterize a custom library of interconnect elements in no time.

A detailed overview of the interconnect simulation process can be found in an application sheet. Please contact us to receive a copy.